The future of the automotive industry is highly dependent on the integration of electronics into vehicles, particularly as the deployment of advanced electric vehicles (EVs) with varying levels of autonomy have come to fruition. On-board sensors in today's automobiles, such as cameras, radars, lidars, and ultrasonic radars, provide detection and uniformity scenarios in various environments and weather conditions. New technologies have also been deployed, such as 3-D vision and global navigation satellite systems (GNSS). In addition, 5G networks are impacting the development of connected and autonomous vehicles (AVs) making them safer and smarter. The use of on-board sensors in vehicles requires testing, verification, and validation, in order to provide safety, stability, reliability, and precision. Integration of these various systems and networks will aid in the creation of the vehicle-to-everything (V2X) environment. Silicon based integrated circuit (IC) architecture, such as SiGe CMOS and BiCMOS have enabled scaling and cost reduction of advanced sensors. The semiconductor’s value stack of multiple IC architectures, cost advantages, reliability, and sensor fusion can be combined with 5G/mmWave networks for Silicon and Gallium Nitride (GaN) technologies. Advanced materials will also play a pivotal role in driving the further scaling of sensors. These approaches currently play a key role in the process and manufacture of CMOS and MOSFETS. In this paper, an analysis of the current state of advanced sensors is presented, along with semiconductor process advances for AVs. IC innovations such as system integration, sensor local systems, and sensor health are also covered.
| Published in | Journal of Electrical and Electronic Engineering (Volume 10, Issue 5) |
| DOI | 10.11648/j.jeee.20221005.13 |
| Page(s) | 199-206 |
| Creative Commons |
This is an Open Access article, distributed under the terms of the Creative Commons Attribution 4.0 International License (http://creativecommons.org/licenses/by/4.0/), which permits unrestricted use, distribution and reproduction in any medium or format, provided the original work is properly cited. |
| Copyright |
Copyright © The Author(s), 2022. Published by Science Publishing Group |
Autonomous Vehicle (AV), Camera, Lidar, Radar, BiCMOS, SWIR, SiGe, GaN
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APA Style
Jorge Vargas, Antonio Saavedra. (2022). Sensor Analysis and Semiconductor Process Advances for Autonomous Vehicles. Journal of Electrical and Electronic Engineering, 10(5), 199-206. https://doi.org/10.11648/j.jeee.20221005.13
ACS Style
Jorge Vargas; Antonio Saavedra. Sensor Analysis and Semiconductor Process Advances for Autonomous Vehicles. J. Electr. Electron. Eng. 2022, 10(5), 199-206. doi: 10.11648/j.jeee.20221005.13
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Download@article{10.11648/j.jeee.20221005.13,
author = {Jorge Vargas and Antonio Saavedra},
title = {Sensor Analysis and Semiconductor Process Advances for Autonomous Vehicles},
journal = {Journal of Electrical and Electronic Engineering},
volume = {10},
number = {5},
pages = {199-206},
doi = {10.11648/j.jeee.20221005.13},
url = {https://doi.org/10.11648/j.jeee.20221005.13},
eprint = {https://article.sciencepublishinggroup.com/pdf/10.11648.j.jeee.20221005.13},
abstract = {The future of the automotive industry is highly dependent on the integration of electronics into vehicles, particularly as the deployment of advanced electric vehicles (EVs) with varying levels of autonomy have come to fruition. On-board sensors in today's automobiles, such as cameras, radars, lidars, and ultrasonic radars, provide detection and uniformity scenarios in various environments and weather conditions. New technologies have also been deployed, such as 3-D vision and global navigation satellite systems (GNSS). In addition, 5G networks are impacting the development of connected and autonomous vehicles (AVs) making them safer and smarter. The use of on-board sensors in vehicles requires testing, verification, and validation, in order to provide safety, stability, reliability, and precision. Integration of these various systems and networks will aid in the creation of the vehicle-to-everything (V2X) environment. Silicon based integrated circuit (IC) architecture, such as SiGe CMOS and BiCMOS have enabled scaling and cost reduction of advanced sensors. The semiconductor’s value stack of multiple IC architectures, cost advantages, reliability, and sensor fusion can be combined with 5G/mmWave networks for Silicon and Gallium Nitride (GaN) technologies. Advanced materials will also play a pivotal role in driving the further scaling of sensors. These approaches currently play a key role in the process and manufacture of CMOS and MOSFETS. In this paper, an analysis of the current state of advanced sensors is presented, along with semiconductor process advances for AVs. IC innovations such as system integration, sensor local systems, and sensor health are also covered.},
year = {2022}
}
TY - JOUR T1 - Sensor Analysis and Semiconductor Process Advances for Autonomous Vehicles AU - Jorge Vargas AU - Antonio Saavedra Y1 - 2022/10/11 PY - 2022 N1 - https://doi.org/10.11648/j.jeee.20221005.13 DO - 10.11648/j.jeee.20221005.13 T2 - Journal of Electrical and Electronic Engineering JF - Journal of Electrical and Electronic Engineering JO - Journal of Electrical and Electronic Engineering SP - 199 EP - 206 PB - Science Publishing Group SN - 2329-1605 UR - https://doi.org/10.11648/j.jeee.20221005.13 AB - The future of the automotive industry is highly dependent on the integration of electronics into vehicles, particularly as the deployment of advanced electric vehicles (EVs) with varying levels of autonomy have come to fruition. On-board sensors in today's automobiles, such as cameras, radars, lidars, and ultrasonic radars, provide detection and uniformity scenarios in various environments and weather conditions. New technologies have also been deployed, such as 3-D vision and global navigation satellite systems (GNSS). In addition, 5G networks are impacting the development of connected and autonomous vehicles (AVs) making them safer and smarter. The use of on-board sensors in vehicles requires testing, verification, and validation, in order to provide safety, stability, reliability, and precision. Integration of these various systems and networks will aid in the creation of the vehicle-to-everything (V2X) environment. Silicon based integrated circuit (IC) architecture, such as SiGe CMOS and BiCMOS have enabled scaling and cost reduction of advanced sensors. The semiconductor’s value stack of multiple IC architectures, cost advantages, reliability, and sensor fusion can be combined with 5G/mmWave networks for Silicon and Gallium Nitride (GaN) technologies. Advanced materials will also play a pivotal role in driving the further scaling of sensors. These approaches currently play a key role in the process and manufacture of CMOS and MOSFETS. In this paper, an analysis of the current state of advanced sensors is presented, along with semiconductor process advances for AVs. IC innovations such as system integration, sensor local systems, and sensor health are also covered. VL - 10 IS - 5 ER -
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